Hot roll embossing in thermoplastic foils using dry-etched...

Microelectronic Engineering 2011 Vol. 88; Iss. 8

Hot roll embossing in thermoplastic foils using dry-etched silicon stamp and multiple passes

Khaled Metwally, Samuel Queste, Laurent Robert, Roland Salut, Chantal Khan-malek
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Volume:
88
Year:
2011
Language:
english
Pages:
4
DOI:
10.1016/j.mee.2011.02.009
File:
PDF, 595 KB
english, 2011
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