Mechanism and thermal effect of delamination in light-emitting diode packages
Jianzheng Hu, Lianqiao Yang, Moo Whan ShinVolume:
38
Year:
2007
Language:
english
Pages:
7
DOI:
10.1016/j.mejo.2006.08.001
File:
PDF, 1.19 MB
english, 2007