![](/img/cover-not-exists.png)
HERMETIC PACKAGING OF MEMS WITH THICK ELECTRODES BY SILICON-GLASS ANODIC BONDING
JIN, YUFENG, WEI, JUN, LIM, PECK CHENG, WANG, ZHENFENGVolume:
4
Language:
english
Journal:
International Journal of Computational Engineering Science
DOI:
10.1142/S1465876303001216
Date:
June, 2003
File:
PDF, 636 KB
english, 2003