Adhesion between Ni/Fe lead frame and epoxy molding...

Journal of Adhesion Science and Technology 1996 / 01 Vol. 10; Iss. 1

Adhesion between Ni/Fe lead frame and epoxy molding compounds in IC packages

Asai, SHIN'ICHIRO, Ando, Takayuki, Tobita, Masayuki
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Volume:
10
Language:
english
Journal:
Journal of Adhesion Science and Technology
DOI:
10.1163/156856196x00418
Date:
January, 1996
File:
PDF, 1.80 MB
english, 1996
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