The effect of solder paste composition on the reliability...

Microelectronics Reliability 2004 Vol. 44; Iss. 3

The effect of solder paste composition on the reliability of SnAgCu joints

S. Nurmi, J. Sundelin, E. Ristolainen, T. Lepistö
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Volume:
44
Year:
2004
Language:
english
Pages:
10
DOI:
10.1016/j.microrel.2003.08.004
File:
PDF, 565 KB
english, 2004
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