Interfacial delamination and fatigue life estimation of 3D...

Interfacial delamination and fatigue life estimation of 3D solder bumps in flip-chip packages

Yu Gu, Toshio Nakamura
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Volume:
44
Year:
2004
Language:
english
Pages:
13
DOI:
10.1016/j.microrel.2003.11.002
File:
PDF, 761 KB
english, 2004
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