Parametric FE-approach to flip-chip reliability under various loading conditions
B. Wunderle, W. Nüchter, A. Schubert, B. Michel, H. ReichlVolume:
44
Year:
2004
Language:
english
Pages:
13
DOI:
10.1016/j.microrel.2004.04.021
File:
PDF, 770 KB
english, 2004