![](/img/cover-not-exists.png)
Evolution of microstructure and failure mechanism of lead-free solder interconnections in power cycling and thermal shock tests
T. Laurila, T. Mattila, V. Vuorinen, J. Karppinen, J. Li, M. Sippola, J.K. KivilahtiVolume:
47
Year:
2007
Language:
english
Pages:
10
DOI:
10.1016/j.microrel.2006.07.095
File:
PDF, 1.53 MB
english, 2007