Evolution of microstructure and failure mechanism of...

Evolution of microstructure and failure mechanism of lead-free solder interconnections in power cycling and thermal shock tests

T. Laurila, T. Mattila, V. Vuorinen, J. Karppinen, J. Li, M. Sippola, J.K. Kivilahti
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Volume:
47
Year:
2007
Language:
english
Pages:
10
DOI:
10.1016/j.microrel.2006.07.095
File:
PDF, 1.53 MB
english, 2007
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