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3-D Thermal Component Model for Electrothermal Analysis of...

3-D Thermal Component Model for Electrothermal Analysis of Multichip Power Modules With Experimental Validation

Reichl, John, Ortiz-Rodriguez, Jose M., Hefner, Allen, Lai, Jih-Sheng
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Volume:
30
Language:
english
Journal:
IEEE Transactions on Power Electronics
DOI:
10.1109/tpel.2014.2338278
Date:
June, 2015
File:
PDF, 891 KB
english, 2015
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