3-D Thermal Component Model for Electrothermal Analysis of Multichip Power Modules With Experimental Validation
Reichl, John, Ortiz-Rodriguez, Jose M., Hefner, Allen, Lai, Jih-ShengVolume:
30
Language:
english
Journal:
IEEE Transactions on Power Electronics
DOI:
10.1109/tpel.2014.2338278
Date:
June, 2015
File:
PDF, 891 KB
english, 2015