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Thermal approach of defects generation on copper/organic dielectric interface due to SEM inspections
L. Dantas de Morais, F. Allanic, F. Roqueta, J.P. RebrasseVolume:
47
Year:
2007
Language:
english
Pages:
5
DOI:
10.1016/j.microrel.2007.07.056
File:
PDF, 560 KB
english, 2007