3D Modeling of electromigration combined with thermal–mechanical effect for IC device and package
Yong Liu, Lihua Liang, Scott Irving, Timwah LukVolume:
48
Year:
2008
Language:
english
Pages:
14
DOI:
10.1016/j.microrel.2008.03.021
File:
PDF, 4.38 MB
english, 2008