Fabrication and thermal analysis of flip-chip...

Microelectronics Reliability 2010 Vol. 50; Iss. 5

Fabrication and thermal analysis of flip-chip light-emitting diodes with different numbers of Au stub bumps

Cheng-Chen Lin, Liann-Be Chang, Ming-Jer Jeng, Chia-Yi Yen, Atanu Das, Chung-Yi Tang, Ming-Yi Tsai, Mu-Jen Lai
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
50
Year:
2010
Language:
english
Pages:
5
DOI:
10.1016/j.microrel.2010.01.036
File:
PDF, 925 KB
english, 2010
Conversion to is in progress
Conversion to is failed