Design, assembly and reliability of large die and fine-pitch Cu/low-k flip chip package
Yue Ying Ong, Soon Wee Ho, Kripesh Vaidyanathan, Vasarla Nagendra Sekhar, Ming Chinq Jong, Samuel Lim Yak Long, Vincent Lee Wen Sheng, Leong Ching Wai, Vempati Srinivasa Rao, Jimmy Ong, Xuefen Ong, XiVolume:
50
Year:
2010
Language:
english
Pages:
9
DOI:
10.1016/j.microrel.2010.03.010
File:
PDF, 805 KB
english, 2010