Nickel–palladium bond pads for copper wire bonding

Microelectronics Reliability 2011 Vol. 51; Iss. 1

Nickel–palladium bond pads for copper wire bonding

Horst Clauberg, Petra Backus, Bob Chylak
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Volume:
51
Year:
2011
Language:
english
Pages:
6
DOI:
10.1016/j.microrel.2010.05.001
File:
PDF, 615 KB
english, 2011
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