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Effect of surface roughness of silicon die and copper heat spreader on thermal performance of HFCBGA
Tong Hong Wang, Sara N. Paisner, Chang-Chi Lee, Susan Chen, Yi-Shao LaiVolume:
51
Year:
2011
Language:
english
Pages:
5
DOI:
10.1016/j.microrel.2011.03.025
File:
PDF, 778 KB
english, 2011