A New Approach to the Copper/Epoxy Joint Using Atmospheric Pressure Glow Discharge
Sawada, Y., Ogawa, S., Kogoma, M.Volume:
53
Language:
english
Journal:
The Journal of Adhesion
DOI:
10.1080/00218469508009937
Date:
October, 1995
File:
PDF, 530 KB
english, 1995