The microstructure of Sn in near-eutectic Sn–Ag–Cu alloy solder joints and its role in thermomechanical fatigue
Henderson, Donald W., Woods, James J., Gosselin, Timothy A., Bartelo, Jay, King, David E., Korhonen, T.M., Korhonen, M.A., Lehman, L.P., Cotts, E.J., Kang, Sung K., Lauro, Paul, Shih, Da-Yuan, GoldsmiVolume:
19
Language:
english
Journal:
Journal of Materials Research
DOI:
10.1557/jmr.2004.0222
Date:
June, 2004
File:
PDF, 3.79 MB
english, 2004