Three-Dimensional Integration of Fully Depleted...

ECS Transactions 2014 / 08 Vol. 64; Iss. 5

Three-Dimensional Integration of Fully Depleted Silicon-on-Insulator Transistor Substrates for CMOS Image Sensors Using Au/SiO2 Hybrid Bonding and XeF2 Etching

Hagiwara, K., Goto, M., Iguchi, Y., Ohtake, H., Saraya, T., Toshiyoshi, H., Higurashi, E., Hiramoto, T.
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Volume:
64
Language:
english
Journal:
ECS Transactions
DOI:
10.1149/06405.0391ecst
Date:
August, 2014
File:
PDF, 828 KB
english, 2014
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