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Electrical Properties of Copper-Filled Electrically Conductive Adhesives and Pressure-Dependent Conduction Behavior of Copper Particles
Lin, Yung-Sen, Chiu, Sheng-ShiangVolume:
22
Language:
english
Journal:
Journal of Adhesion Science and Technology
DOI:
10.1163/156856108x320537
Date:
January, 2008
File:
PDF, 3.13 MB
english, 2008