![](/img/cover-not-exists.png)
Experimental and finite element analysis of the shear speed effects on the Sn–Ag and Sn–Ag–Cu BGA solder joints
Jong-Woong Kim, Seung-Boo JungVolume:
371
Year:
2004
Language:
english
Pages:
10
DOI:
10.1016/j.msea.2003.12.012
File:
PDF, 908 KB
english, 2004