A new approach for evaluating thin film interface fracture...

Materials Science and Engineering: A 2006 Vol. 426; Iss. 1-2

A new approach for evaluating thin film interface fracture toughness

Jy-An John Wang, Ian G. Wright, Michael J. Lance, Ken C. Liu
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Volume:
426
Year:
2006
Language:
english
Pages:
14
DOI:
10.1016/j.msea.2006.04.022
File:
PDF, 1.00 MB
english, 2006
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