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In situ TEM observation of microcrack nucleation and propagation in pure tin solder
Ying Ding, Chunqing Wang, Mingyu Li, Weiqiang WangVolume:
127
Year:
2006
Language:
english
Pages:
8
DOI:
10.1016/j.mseb.2005.09.050
File:
PDF, 398 KB
english, 2006