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Voiding Phenomena in Copper-Copper Bonded Structures: Role of Creep
Gondcharton, P., Imbert, B., Benaissa, L., Verdier, M.Volume:
4
Language:
english
Journal:
ECS Journal of Solid State Science and Technology
DOI:
10.1149/2.0081503jss
Date:
January, 2015
File:
PDF, 767 KB
english, 2015