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Use of Slurry Colloidal Behavior in Modeling of Material Removal Rates for Copper CMP
Gopal, Tanuja, Talbot, Jan B.Volume:
154
Year:
2007
Language:
english
Journal:
Journal of The Electrochemical Society
DOI:
10.1149/1.2718474
File:
PDF, 189 KB
english, 2007