A Deterministic Semi-Analytical Model for the Contact of a Wafer and a Rough Bi-Layer Pad in CMP
Yu, C., Wang, Z., Sun, F., Lu, S., Keer, L. M., Wang, Q. J.Volume:
2
Language:
english
Journal:
ECS Journal of Solid State Science and Technology
DOI:
10.1149/2.017309jss
Date:
June, 2013
File:
PDF, 1.52 MB
english, 2013