Non-destructive wafer-level bond defect identification by...

Microsystem Technologies 2015 / 7 Vol. 21; Iss. 7

Non-destructive wafer-level bond defect identification by scanning acoustic microscopy

Brand, S., Tismer, S., Moe, S. T., Schjølberg-Henriksen, K.
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Volume:
21
Language:
english
Journal:
Microsystem Technologies
DOI:
10.1007/s00542-014-2328-z
Date:
July, 2015
File:
PDF, 1.29 MB
english, 2015
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