[ECS 214th ECS Meeting - Honolulu, HI (October 12 - October 17, 2008)] ECS Transactions - 150 mm InP-to-Silicon Direct Wafer Bonding for Silicon Photonic Integrated Circuits
Liang, Di, Fang, Alexander, Oakley, Douglas, Napoleone, Antonio, Chapman, David, Chen, Chang-Lee, Juodawlkis, Paul, Raday, Omri, Bowers, John E.Volume:
16
Year:
2008
Language:
english
DOI:
10.1149/1.2982874
File:
PDF, 360 KB
english, 2008