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Interfacial Reaction and Bump Shear Property of Electroplated Sn-37Pb Solder Bump with Ni under Bump Metallization during Multiple Reflows
Koo, Ja Myeong, Jung, Seung BooVolume:
15-17
Year:
2007
Language:
english
Journal:
Advanced Materials Research
DOI:
10.4028/www.scientific.net/AMR.15-17.181
File:
PDF, 3.70 MB
english, 2007