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Manufacturable 300mm Wafer Thinning for 3D Interconnect Applications
Qureshi, Jamal, Caramto, Raymond, Olson, Stephen, Mase, Jerry, Ito, Toshihiro, Yamamoto, EiichiVolume:
1249
Language:
english
Journal:
MRS Proceedings
DOI:
10.1557/PROC-1249-E01-02
Date:
January, 2010
File:
PDF, 1.00 MB
english, 2010