Silicon Layer Stacking Enabled by Wafer Bonding

MRS Proceedings 2006 / 1 Vol. 970

Silicon Layer Stacking Enabled by Wafer Bonding

Tan, Chuan Seng, Chen, Kuan-Neng, Fan, Andy, Chandrakasan, Anantha, Reif, Rafael
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Volume:
970
Language:
english
Journal:
MRS Proceedings
DOI:
10.1557/PROC-0970-Y04-01
Date:
January, 2006
File:
PDF, 2.87 MB
english, 2006
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