Localized recrystallization and cracking of lead-free...

Journal of Materials Research 2011 / 8 Vol. 26; Iss. 16

Localized recrystallization and cracking of lead-free solder interconnections under thermal cycling

Chen, Hongtao, Mueller, Maik, Mattila, Tonu Tuomas, Li, Jue, Liu, Xuwen, Wolter, Klaus-Juergen, Paulasto-Kröckel, Mervi
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Volume:
26
Language:
english
Journal:
Journal of Materials Research
DOI:
10.1557/jmr.2011.197
Date:
August, 2011
File:
PDF, 1.66 MB
english, 2011
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