Ultralow-k/Cu Damascene Multilevel Interconnects Using High...

Journal of The Electrochemical Society 2010 Vol. 157; Iss. 5

Ultralow-k/Cu Damascene Multilevel Interconnects Using High Porosity and High Modulus Self-Assembled Porous Silica

Chikaki, Shinichi, Kinoshita, Keizo, Kohmura, Kazuo, Tanaka, Hirofumi, Soda, Eiichi, Suzuki, Takamasa, Seino, Yutaka, Hata, Nobuhiro, Saito, Shuichi, Kikkawa, Takamaro
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Volume:
157
Year:
2010
Language:
english
Journal:
Journal of The Electrochemical Society
DOI:
10.1149/1.3355891
File:
PDF, 1000 KB
english, 2010
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