Pad Wear Analysis during Interlayer Dielectric Chemical Mechanical Planarization
Jiao, Y., Zhuang, Y., Wei, X., Sampurno, Y., Meled, A., Theng, S., Cheng, J., Hooper, D., Moinpour, M., Philipossian, A.Volume:
1
Language:
english
Journal:
ECS Journal of Solid State Science and Technology
DOI:
10.1149/2.022205jss
Date:
September, 2012
File:
PDF, 452 KB
english, 2012