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A fabrication process based on structural layer formation using Au–Au thermocompression bonding for RF MEMS capacitive switches and their performance
Cetintepe, Cagri, Topalli, Ebru Sagiroglu, Demir, Simsek, Civi, Ozlem Aydin, Akin, TayfunVolume:
6
Language:
english
Journal:
International Journal of Microwave and Wireless Technologies
DOI:
10.1017/S1759078714000968
Date:
October, 2014
File:
PDF, 585 KB
english, 2014