Copper CMP Formulation for 65 nm Device Planarization

MRS Proceedings 2004 / 1 Vol. 816

Copper CMP Formulation for 65 nm Device Planarization

Stauf, Gregory T., Boggs, Karl, Wrschka, Peter, Ragaglia, Craig, Darsillo, Michael, Roeder, Jeffrey F., King, Mackenzie, Liu, Jun, Baum, Thomas
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Volume:
816
Language:
english
Journal:
MRS Proceedings
DOI:
10.1557/PROC-816-K1.3
Date:
January, 2004
File:
PDF, 774 KB
english, 2004
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