Electromigration Behaviors and Effects of Addition Elements...

Journal of Electronic Materials 2014 / 11 Vol. 43; Iss. 11

Electromigration Behaviors and Effects of Addition Elements on the Formation of a Bi-rich Layer in Sn58Bi-Based Solders

Zhao, Xu, Saka, Masumi, Muraoka, Mikio, Yamashita, Mitsuo, Hokazono, Hiroaki
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Volume:
43
Language:
english
Journal:
Journal of Electronic Materials
DOI:
10.1007/s11664-014-3400-2
Date:
November, 2014
File:
PDF, 3.54 MB
english, 2014
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