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Simplified heat transfer modeling for Vapour Phase Soldering based on filmwise condensation for different horizontal Printed Circuit Boards
Géczy, Attila, Illés, Balázs, Péter, Zsolt, Illyefalvi-Vitéz, ZsoltVolume:
51
Language:
english
Journal:
Heat and Mass Transfer
DOI:
10.1007/s00231-014-1386-1
Date:
March, 2015
File:
PDF, 969 KB
english, 2015