Microstructure and Mechanical Properties of Electroplated...

MRS Proceedings 2000 / 1 Vol. 649

Microstructure and Mechanical Properties of Electroplated Cu Thin Films

Volinsky, A.A., Vella, J., Adhihetty, I.S., Sarihan, V., Mercado, L., Yeung, B.H., Gerberich, W.W.
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Volume:
649
Language:
english
Journal:
MRS Proceedings
DOI:
10.1557/proc-649-q5.3
Date:
January, 2000
File:
PDF, 1.25 MB
english, 2000
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