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Effect of Nano-Size Silica Abrasives in Chemical Mechanical Polishing of Copper
Jung, Su-Ho, Singh, Rajiv K.Volume:
816
Language:
english
Journal:
MRS Proceedings
DOI:
10.1557/PROC-816-K1.8
Date:
January, 2004
File:
PDF, 221 KB
english, 2004