Thermal analysis and optimization for a ball grid array...

ARCHIVE Proceedings of the Institution of Mechanical Engineers Part C Journal of Mechanical Engineering Science 1989-1996 (vols 2005 / 4 Vol. 219; Iss. 4

Thermal analysis and optimization for a ball grid array package

Ho, C-I, Hung, T-C, Hung, C-I
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Volume:
219
Language:
english
Journal:
Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science
DOI:
10.1243/095440605X16893
Date:
April, 2005
File:
PDF, 879 KB
english, 2005
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