Deposition of Low Resistivity Copper Conductive Layers by...

Electrochemical and Solid-State Letters 2003 Vol. 6; Iss. 7

Deposition of Low Resistivity Copper Conductive Layers by Electroplating from a Copper Hexafluorosilicate Solution

Hara, Tohru, Shimura, Yasu, Toida, Hiroki
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Volume:
6
Year:
2003
Language:
english
Journal:
Electrochemical and Solid-State Letters
DOI:
10.1149/1.1574233
File:
PDF, 331 KB
english, 2003
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