Adhesion of Cu and low-k Dielectric Thin Films with...

Journal of Materials Research 2002 / 6 Vol. 17; Iss. 6

Adhesion of Cu and low-k Dielectric Thin Films with Tungsten Carbide

Lemonds, A. M., Kershen, K., Bennett, J., Pfeifer, K., Sun, Y-M., White, J. M., Ekerdt, J. G.
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Volume:
17
Language:
english
Journal:
Journal of Materials Research
DOI:
10.1557/JMR.2002.0197
Date:
June, 2002
File:
PDF, 362 KB
english, 2002
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