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Microstructural evolution in lead-free solder alloys: Part II. Directionally solidified Sn-Ag-Cu, Sn-Cu and Sn-Ag
Allen, Sarah L., Notis, Michael R., Chromik, Richard R., Vinci, Richard P., Lewis, Daniel J., Schaefer, RobertVolume:
19
Language:
english
Journal:
Journal of Materials Research
DOI:
10.1557/JMR.2004.0191
Date:
May, 2004
File:
PDF, 647 KB
english, 2004