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Stress relaxation and failure behavior of Sn–3.0Ag–0.5Cu flip-chip solder bumps undergoing electromigration
Huang, Mingliang, Zhang, Zhijie, Zhou, Shaoming, Chen, LeidaVolume:
29
Language:
english
Journal:
Journal of Materials Research
DOI:
10.1557/jmr.2014.231
Date:
November, 2014
File:
PDF, 776 KB
english, 2014