Predictions and measurements of interfacial adhesion among...

Thin Solid Films 2015 / 06 Vol. 584

Predictions and measurements of interfacial adhesion among encapsulated thin films of flexible devices

Lee, Chang-Chun, Wei, Pal-Jen, Chian, Bow-Tsin, Tsai, Chia-Hao, Dzeng, Yu-Hua
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Volume:
584
Language:
english
Journal:
Thin Solid Films
DOI:
10.1016/j.tsf.2015.01.020
Date:
June, 2015
File:
PDF, 2.31 MB
english, 2015
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