3D Thermal-Fluid and Stress Analysis for Single Chip SiC...

MRS Proceedings 2009 / 1 Vol. 1158

3D Thermal-Fluid and Stress Analysis for Single Chip SiC Power Sub-Modules

Tsao, Bang-Hung, Sondergelt, Katie, Lawson, Jacob, Scofield, James, Elston, Levi
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Volume:
1158
Language:
english
Journal:
MRS Proceedings
DOI:
10.1557/PROC-1158-F03-06
Date:
January, 2009
File:
PDF, 986 KB
english, 2009
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