Evaluation of BCB Bonded and Thinned Wafer Stacks for...

Journal of The Electrochemical Society 2008 Vol. 155; Iss. 5

Evaluation of BCB Bonded and Thinned Wafer Stacks for Three-Dimensional Integration

Kwon, Yongchai, Jindal, Anurag, Augur, Rod, Seok, Jongwon, Cale, Timothy S., Gutmann, Ronald J., Lu, Jian-Qiang
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Volume:
155
Year:
2008
Language:
english
Journal:
Journal of The Electrochemical Society
DOI:
10.1149/1.2844449
File:
PDF, 956 KB
english, 2008
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