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Evaluation of stress field parameters for an interface crack in a bimaterial by digital photoelasticity
Ravichandran, M, Ramesh, KVolume:
40
Language:
english
Journal:
The Journal of Strain Analysis for Engineering Design
DOI:
10.1243/030932405X16034
Date:
January, 2005
File:
PDF, 677 KB
english, 2005