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Orientation transformation of Pb grains in 5Sn–95Pb/ 63Sn–37Pb composite flip-chip solder joints during electromigration test
Chiu, Ying-Ta, Lin, Kwang-Lung, Lai, Yi-ShaoVolume:
23
Language:
english
Journal:
Journal of Materials Research
DOI:
10.1557/JMR.2008.0227
Date:
July, 2008
File:
PDF, 930 KB
english, 2008