Si Wafer Bonding: Structural Features of the Interface

Solid State Phenomena 2009 / 10 Vol. 156-158

Si Wafer Bonding: Structural Features of the Interface

Vdovin, V.I., Zakharov, N.D., Pippel, Eckhard, Werner, P., Milvidskii, M.G., Ries, M., Seacrist, M., Falster, Robert J.
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Volume:
156-158
Language:
english
Journal:
Solid State Phenomena
DOI:
10.4028/www.scientific.net/SSP.156-158.85
Date:
October, 2009
File:
PDF, 1.27 MB
english, 2009
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